Flight-ready hardware for zero failure
Class 3
IPC SMT Standards
MIL-810
Environmental Qualification
IP67
Sealed Enclosure Rating



Edge Intelligence
Implement high-throughput neural inference engines directly on low-power, thermal-constrained embedded hardware. Designed specifically for autonomous defense systems functioning under real-time processing requirements without the need for external network connectivity.
Every design consideration features optimized direct copper heat dissipation pathways and components selected for their resistance to radiation, guaranteeing no thermal throttling during prolonged high load operations.



IPC Class 3 assembly standards
Surface Mount Technology
High-density SMT & PTH assembly
Rigid-flex multi-layer PCB assembly featuring sub-mil placement precision, automated optical verification, and 3D X-ray inspection for micro-BGA solder joint integrity.
Conformal Protection
High performancecoatings and pottings
High performance conformal coatings providing total dielectric barrier protection against humidity, chemicals, and high-altitude arcing.
R&D and Rapid Prototyping
Enclosures, firmware, and rapid prototyping




Our focused R&D along with in-house design and manufacturing enables us to quickly design, test, and guarantee deployment stability across all platforms

IP67 Sealed Enclosures
Embedded Firmware & RTOS
CAD & Rapid Iteration
CNC machined 6061-T6 aluminum and specialized 3D printing materials tailored to the specific requirements of the project.
Bare-metal C/C++ architecture and real-time operating system implementation with hardware-rooted security keys.
Material Deposition and SLA 3D Print accelerated pre-production verification and testing.
Direct technical consultation with ArcForge hardware systems engineers in Huntsville, Alabama.


